IH soldering device "S-WAVE" *Free testing currently available

For those who want to reduce solder loss! Contributing to automation of processes and reduction of defects with non-contact soldering. Also compatible with soldering from the underside, like in flow processes.

The "S-WAVE" is a device that enables soldering through non-contact, localized heating using induction heating, while minimizing losses associated with contact during the process. By controlling the heating of the substrate and solder through the magnetic flux generated around the pins, it is possible to achieve an appropriate fillet shape and through-hole exit. Additionally, with four types of magnetic concentration heads, it can accommodate workpieces ranging from Φ0.3 to Φ1.5 with a single device. You can rely on us to solve challenges in soldering, such as improving the efficiency of localized soldering, reducing defects, and suppressing solder balls. ★ Free testing available. You can apply through "Contact Us." 【Features】 ■ Contributes to reducing production losses through non-contact localized heating ■ Offers both top heating type and bottom heating type for inline applications ■ Capable of equipping an automatic flux removal function at the head tip ■ An automatic heating power inspection tool can also be equipped * For more details, please view the PDF data by downloading the catalog. * If you wish to request a free test, please select "Request Demo" from "Contact Us" on the web.

Soldering Equipment