Rishorite printed circuit board materials for automotive equipment

basic information

This is a printed circuit board material that has the necessary performance for each automotive device, such as high thermal conductivity, long-term heat resistance, low transmission loss, and resistance to solder cracking. There are also high thermal conductivity adhesive sheets for attaching substrates that carry heat-generating components, such as high-brightness LEDs and power semiconductors, to heat sinks.

Price range

Delivery Time

Applications/Examples of results

Printed circuit boards mounted in automotive equipment such as LED lamps, inverters/converters, millimeter-wave radar, engine control units, and light sensors.

Detailed information

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  ▼CC-7210 This is a copper-based printed wiring board material for power conversion devices in electric vehicles, such as inverters and converters. The 7210 series resin arranged on the surface of the copper plate has a thermal conductivity of 10W/mK and insulation reliability that withstands high voltage of 5000 volts even at a thickness of 0.12mm. It also has high heat resistance with a Tg of 270°C. It exhibits heat dissipation effects equivalent to ceramic substrates and can be offered at a lower price than these.

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  ▼CC-7208 is a sister product of CC-7210. By reducing the thermal conductivity of the insulating layer to 8W/mK, we can offer it at an even lower price.

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  Electronic devices mounted in automobiles are subjected to high temperatures for extended periods, so "long-term heat resistance" is an essential requirement. CS-3305A is an ultra-high heat-resistant printed wiring board material with a Tg of over 300°C, and this performance is stably maintained over a long period. Additionally, it is less prone to warping even when heated as a thin sheet, which reduces the likelihood of circuit disconnection. We recommend it for devices such as engine control units, ETC, car navigation systems, and drive recorders.

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  ▼CS-3305K This is a sister product with performance equivalent to the CS-3305A. It does not contain fillers in the resin, which enhances the embedding capability of the parts.

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  This is a printed circuit board material with the performance of "low transmission loss," meaning it can transmit signals faster and in greater quantities without attenuating high-frequency signals. It is expected to offer performance comparable to expensive PTFE (polytetrafluoroethylene) substrates, but at about half the price. We recommend its use for millimeter-wave radar substrates.

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  ▼AC-7303 This is an aluminum-based printed wiring board designed for electronic devices installed in harsh temperature conditions, such as outside the vehicle like headlights or in the engine room. The 7303 series resin applied to the surface of the aluminum plate remains very flexible even after curing. This flexibility absorbs the thermal expansion and contraction of the aluminum plate, making it less likely to stress the solder joints of the components and reducing the occurrence of cracks.

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  CS-3667B is a high-heat-resistant black printed circuit board material designed to accommodate light-emitting and light-receiving elements of optical sensors. To prevent malfunction and sensitivity reduction, it is necessary to optically separate the light-emitting and light-receiving elements. CS-3667B not only shields visible light but also blocks light from red to near-infrared used in sensors, making it suitable for substrates that house sensor components.

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  This is a printed circuit board material with a resin surface in white, designed with the incorporation of LED components in mind. Its thermal conductivity is approximately four times that of typical materials at 1.3 W/mK, and when made into a 0.1 mm thin sheet, it exhibits excellent heat dissipation, sometimes exceeding expectations, which has led to many successful adoptions.

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  Copper foil with resin (left) and high thermal conductivity adhesive sheet. This is an adhesive with excellent thermal conductivity used to bond a substrate equipped with heating components to a heat dissipation plate. The adhesive sheet consists of a resin with excellent thermal conductivity and insulation reliability, sandwiched between PET film in a semi-cured (B-stage) state, while the copper foil coated with this resin is referred to as copper foil with resin.

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