"Example 2: Classification of anisotropic conductive particles for fine pitch connections" Refer to the attached document.
- Anisotropic conductive particles with a gold plating on the surface of resin, which is essential for high image quality in imaging devices. - The second application is used for connecting numerous circuits and IC chips provided on a glass substrate. - By applying double-sided tape containing anisotropic conductive particles to the circuit portion of the glass substrate, placing the IC chip on it, and pressing the terminal parts of the IC with a jig, it is possible to connect thousands of terminals in a short time. - Similar to spacer particles, "the presence of coarse particles is not allowed even at a ratio of one in ten billion."
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.