セムテックエンジニアリング Company Overview

Introducing the innovative technology developed by Semtech Engineering. Adopted in ultra-high-definition innovations for 4K and 8K LCD TVs, computers, smartphones, and more.

Our company contributes to high reliability, top quality, and application-specific design through ultra-fine processing and ultra-high precision sieving using electroforming technology, as well as the development and contract manufacturing of high-pressure special-shaped holes. We have developed the ultra-high reliability 'sieve' super micro sieve and the classification device 'S-150W' that has mastered non-clogging classification technology, and we will continue to pursue innovative technologies in the future. 【Features of Semtech Engineering's Innovative Technology】 - Established fine processing technology with hole diameters of 5μm, pitch of 15μm, thickness of 50μm, and ultra-high aspect ratio (thickness ÷ hole diameter). - Completely removed trace amounts of coarse particles that do not appear in the particle size distribution at the PPB level for hole diameters of 5μm and above mixed during the manufacturing process. - Capable of creating approximately 160 million holes of 5μm in diameter over an area of 20 centimeters in diameter (see image 1). - Remarkable thickness of ≪30–100μm≫ with hardness HV600, which does not break even when dented (see images 2 and 3). - Application example: Special-shaped nozzles for spinning with high precision, high pressure, and an astonishing number of holes (see image 7 for processing example). - Designed hole shapes, hole diameters, and outer diameters according to the intended use, in addition to sieves (see image 4). *For more details, please refer to the PDF document or feel free to contact us.

This sieve processes high-precision fine holes using a method called electroforming, which combines semiconductor manufacturing technology and electroplating.

■ By using this technology, it is possible to manufacture 'ultra-high reliability sieves' with high precision, high aperture ratio, and high strength, similar to SEM images. ■ When producing particles called functional particles with a diameter of less than Φ5μm, it is used to remove trace amounts of coarse particles at the individual level. ■ Example 1: Liquid crystal panel spacers made of plastic particles Example 2: Liquid crystal panel anisotropic conductive film (ACF particles) Application Example 3: Battery sealing materials, IC package sealing materials Application Example 4: Development of applications for functional particles, quality control in particle manufacturing processes, etc. ■ Minimum hole diameter: Φ5μm, pitch: 15μm (sieves can be manufactured from Φ5 to 50μm) ■ Thickness: 50 to 100μm ■ Material: Nickel, hardness HV 500 to 600, very durable