The important factor in screening is the strength of the sieve; damage to the sieve has a significant impact on the product, so quality is verified through rigorous testing.
■ The photo in the center shows the dent created when the tip of a flathead screwdriver was dropped from 7 cm above the screen. The "Super Micro Sieve" is a sieve that withstands even formidable damage. ■ The photo on the right shows the condition of a hole that was damaged during use in a typical sieve. "Coarse particles mix into the product from the damaged area." ■ The aspect ratio serves as a guideline for evaluating the technical level of sieves. 1. Our company: Plate thickness (50) ÷ Hole diameter (5) = Aspect ratio 10, high strength. 2. Competitor: Plate thickness (10) ÷ Hole diameter (5) = Aspect ratio 2, thin, risk of damage. Challenge ■ Currently developing Super Micro Sieves with even smaller hole diameters of Φ1 and Φ3. ■ While we anticipate technical challenges, innovative ideas often arise from difficult problems.
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.