[Original Technology] Ultra High Reliability Sieve Super Micro Sieve

This sieve processes high-precision fine holes using a method called electroforming, which combines semiconductor manufacturing technology and electroplating.

■ By using this technology, it is possible to manufacture 'ultra-high reliability sieves' with high precision, high aperture ratio, and high strength, similar to SEM images. ■ When producing particles called functional particles with a diameter of less than Φ5μm, it is used to remove trace amounts of coarse particles at the individual level. ■ Example 1: Liquid crystal panel spacers made of plastic particles Example 2: Liquid crystal panel anisotropic conductive film (ACF particles) Application Example 3: Battery sealing materials, IC package sealing materials Application Example 4: Development of applications for functional particles, quality control in particle manufacturing processes, etc. ■ Minimum hole diameter: Φ5μm, pitch: 15μm (sieves can be manufactured from Φ5 to 50μm) ■ Thickness: 50 to 100μm ■ Material: Nickel, hardness HV 500 to 600, very durable

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