New structure ultra-low profile package! Development and provision planned using proprietary technology.
The "Ultra Low Profile Package" is a product that achieves ultra low profile and low resistance wiring through a structure that does not use conventional Cu frames or interposers such as PCBs. We plan to develop and provide the ultra low profile package with a new package structure using our unique technology. 【Features】 ■ Development and provision of ultra low profile packages using unique technology ■ Structure that does not use conventional Cu frames or interposers such as PCBs ■ Ultra low profile and low resistance wiring package ■ Dimple processing at the terminal area *For more details, please refer to the PDF materials or feel free to contact us.
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【Lineup】 ■4pin ■32pin *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.