Formation of solder fillets through special processing! A package using patented technology.
The "Package with Via Holes" utilizes a patented technology that allows for the reliable formation of solder fillets through special processing of the terminal parts, achieving high soldering quality and improved visual inspection after mounting. In standard non-lead packages, there are no terminals on the edge of the PCB, so fillets cannot be formed. Additionally, due to the formation of via holes, solder spreads from the plated area of the via holes, resulting in a package that offers reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ High soldering quality and improved visual inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.
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"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.