Cu frame type "Package with Beer Hall"

Package using patented technology! Formation of solder fillet through special processing.

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

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