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  6. Cu frame type "Package with Beer Hall"

Cu frame type "Package with Beer Hall"

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last updated:Sep 10, 2018

アルス株式会社 本社工場、第2~第5工場
アルス株式会社 本社工場、第2~第5工場
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Package using patented technology! Formation of solder fillet through special processing.

The Cu frame type "Package with Via Holes" is a package that enables the reliable formation of solder fillets due to special processing at the terminal parts. It utilizes patented technology to achieve high soldering quality and improve the appearance inspection after mounting. In standard non-leaded packages, the exposed parts of the lead frame terminals are prone to oxidation, which reduces solder wettability. However, by forming via holes, solder can spread from the plated areas of the via holes, making it suitable for automotive packages with reliable solder joints and visibility for inspection. 【Features】 ■ Reliable formation of solder fillets ■ Achievement of high soldering quality and improved appearance inspection after mounting ■ Package using patented technology ■ Reliable solder joints and visibility for inspection *For more details, please refer to the PDF document or feel free to contact us.

    Other electronic partsCircuit board design and manufacturingContract manufacturing
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Cu frame type "Package with Beer Hall"

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  • Related Link - http://www.arusu.co.jp/solution/pkg/index.html

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Cu frame type "Package with Beer Hall"

Cu frame type "Package with Beer Hall"

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アルス株式会社

アルス株式会社 本社工場、第2~第5工場

Electronic Components and Semiconductors

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"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.

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