Published results of the investigation into the changes in copper thickness of the substrate during lead-free solder reflow processing.
This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.
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【Other Publication Contents】 ■Experimental Method 1. Set the processing solder temperature to 247°C (standard), 255°C, and 260°C. 2. Set the processing time to 5 seconds, 7 seconds (standard), and 10 seconds. 3. Set the number of treatments to 1 time, 3 times, 5 times, and 10 times. Measure the copper thickness before and after processing, and determine the copper consumption. Measurements will be taken using a cross-cut method. *For more details, please refer to the PDF document or feel free to contact us.
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Our company operates as a specialized manufacturer of surface treatment for printed circuit boards. In particular, to respond to the recent demand for short delivery times, we offer same-day processing even for small quantities and a variety of products, and for urgent orders, we complete them while you wait. Of course, we also provide same-day shipping to remote areas. Recently, we have quickly introduced a lead-free solder dedicated leveling machine (made in Japan) to accommodate lead-free solder, which has been well received. If you are facing any issues with surface treatment for printed circuit boards, please feel free to consult us.