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This document summarizes our efforts regarding the guarantee of lead-free solder. It includes the background for using lead-free solder, as well as information on preventing errors and contamination between eutectic solder products and lead-free solder products. [Contents] ■ What is a solder leveler ■ Background for using lead-free solder ■ Types of lead-free solder ■ Currently available solder levelers ■ The necessity of guarantees for lead-free solder ■ Prevention of errors and contamination between eutectic solder products and lead-free solder products ■ Prevention of contamination in lead-free solder ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• others

Under the European RoHS directive, the lead content in solder must be kept below 1000 ppm. However, during an analysis of the final products at the customer site, instances were confirmed where the lead content exceeded the standard value. As a result, it became necessary to check and guarantee the lead content in solder during the manufacturing of printed circuit boards. As a solution, a fluorescent X-ray analyzer was used to check the lead content in the solder bath. Additionally, by using a fluorescent X-ray thickness gauge for simple inspections, we confirmed the mix-up between lead-free solder products and eutectic solder products. By submitting and storing that data and analysis samples, it became possible to establish a system that ensures traceability and guarantees compliance. [Case Summary] ■ Domestic Printed Circuit Board Manufacturer ・Introduced Product: "Lead-Free Solder Leveler" ・Solder Used: Solder Coat Co., Ltd. "LLS-227N・219L" 　　　　　　Fluorescent X-ray Analyzer "SEA1000AIII" *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Soldering Equipment

In addition to domestic factories in Japan, we have also expanded our printed circuit board factories overseas, producing the same product range in both domestic and overseas factories while considering product difficulty and pricing. Domestic printed circuit board manufacturers faced cost challenges due to production in overseas factories. For products with a wide variety, there were significant differences in product difficulty. Therefore, relatively low-difficulty products were prioritized for cost-effective production overseas, while high-difficulty products were produced domestically with a focus on quality. As a result, we introduced cost-effective Sn-Cu-based solder for surface treatment overseas. This not only reduced costs from production in overseas factories but also improved overall quality by aligning operations between domestic and overseas facilities. [Case Study] ■ Domestic Printed Circuit Board Manufacturer ■ Introduced Product: Sn-Cu-based Lead-Free Solder Leveler ■ Solder Used: Solder Coat Co., Ltd. LLS-227N *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Soldering Equipment

"Electrolytic plating" is a method that reduces metal ions through an electrolysis reaction and deposits metal onto the surface of a conductive material at the cathode. The areas that require plating must be connected by lead wires or patterns. When gold plating on copper, it is common to apply a nickel plating as a base layer because gold tends to diffuse into the copper over time. Typically, a thickness of about 3μm is secured. [Features] ■ Easier to increase thickness compared to electroless plating ■ Tends to be thicker on the outer side of the substrate and thinner in the center ■ Hardness is generally high *For more details, please download the PDF or contact us.

• Other metal materials
• others

"Electroless plating" involves applying a catalyst to the surface of a material and precipitating metal through a chemical reduction reaction. It does not use electricity due to the chemical reaction. There is a high degree of freedom in substrate pattern design, and it can utilize either reduction reactions or surface metal replacement reactions. 【Features】 ■ Gold plating is a replacement reaction, resulting in a thickness of approximately 0.03 to 0.05 μm. ■ Tends to have less variation compared to electroplating. ■ There are methods that utilize reduction reactions as well. *For more details, please download the PDF or contact us.

• Other metal materials
• others

"Lead-free solder reflow" refers to the change from conventional solder to lead-free solder. There are many types available, including those that incorporate Bi (bismuth), In (indium), and Al (aluminum). Due to the RoHS directive enacted in 2006, the inclusion of lead in certain products manufactured and sold within the EU has been prohibited, leading to an increase in the transition to lead-free options. 【Features】 ■ Good wetting and through-hole performance ■ Excellent storage stability, making reprocessing easy after aging ■ Minimal variation in surface thickness *For more details, please refer to the PDF materials or feel free to contact us.

• others
• Printed Circuit Board

The "Handa Leveler" is designed to apply a solder coat on the copper surface that forms the land area of printed circuit boards, with the aim of enhancing surface protection and wettability during assembly. The board is immersed in molten solder, and when it is pulled up, high-temperature air is blown from an air knife located above the solder tank to remove excess solder from the board holes, pad surfaces, and resist. This process ensures that only the copper surface is coated with solder. 【Features】 ■ Short processing time allows for high processing capacity ■ Relatively inexpensive ■ Good wettability of solder during assembly ■ High storage stability ■ Reworkable *For more details, please refer to the PDF document or feel free to contact us.

• Printed Circuit Board
• Other electronic parts

Our company has been engaged in "surface treatment of printed circuit boards" for over 35 years. We recognized the importance of lead-free solder early on and introduced a lead-free solder dedicated leveling machine (domestically produced). We accept a wide range of consultations, including cost reduction and quality improvement. Currently, we are distributing company brochures that include materials showcasing examples of cost reduction and quality improvement, as well as information on our main equipment. [Case Overview] <Surface treatment using Sn-Cu lead-free solder leveling machine during parallel production overseas and domestically> We have introduced the Sn-Cu lead-free solder leveling machine used in our customer's overseas factory, contributing to cost reduction and overall quality improvement. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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