Electroplating that makes thickness creation easy. Introducing the process and features. Company brochure available.
"Electrolytic plating" is a method that reduces metal ions through an electrolysis reaction and deposits metal onto the surface of a conductive material at the cathode. The areas that require plating must be connected by lead wires or patterns. When gold plating on copper, it is common to apply a nickel plating as a base layer because gold tends to diffuse into the copper over time. Typically, a thickness of about 3μm is secured. [Features] ■ Easier to increase thickness compared to electroless plating ■ Tends to be thicker on the outer side of the substrate and thinner in the center ■ Hardness is generally high *For more details, please download the PDF or contact us.
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【Electrolytic Nickel - Gold Plating Process】 1. Pre-treatment 2. Acid cleaning 3. Nickel plating 4. Gold plating 5. Inspection (Washing and drying are included between processes) *For more details, please download the PDF or contact us.
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Our company operates as a specialized manufacturer of surface treatment for printed circuit boards. In particular, to respond to the recent demand for short delivery times, we offer same-day processing even for small quantities and a variety of products, and for urgent orders, we complete them while you wait. Of course, we also provide same-day shipping to remote areas. Recently, we have quickly introduced a lead-free solder dedicated leveling machine (made in Japan) to accommodate lead-free solder, which has been well received. If you are facing any issues with surface treatment for printed circuit boards, please feel free to consult us.
