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  6. Introduction to Electroplating Processing Technology

Introduction to Electroplating Processing Technology

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last updated:Nov 12, 2020

フォトプレシジョン
フォトプレシジョン
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Introduction of a plating system compatible with 6-inch wafers! Processing technology capable of forming films of a few micrometers.

"Electroplating" is a processing technology that involves immersing a substrate in an aqueous solution containing ionized metal and passing electricity through the liquid to deposit metal onto the surface of the substrate. Film formation by vapor deposition is usually less than 1μm, but plating can form films of several micrometers. Additionally, there is a technique called "semi-additive method" that utilizes this technology to create fine plating patterns. [Features] - Electricity is passed through the liquid to deposit metal on the surface of the substrate. - Can be used in precision processing fields to increase the thickness of metal films. - Capable of forming films of several micrometers. - Applicable to the "semi-additive method" for creating fine plating patterns. - A plating system compatible with 6-inch wafers has been introduced. *For more details, please refer to the catalog or feel free to contact us.

    Technology Development
『電解メッキ』加工技術紹介.JPG

Introduction to Electroplating Processing Technology

『電解メッキ』加工技術紹介.JPG
『電解メッキ』加工技術紹介.JPG
  • Related Link - http://www.photopre.co.jp/technology/plating.html

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【Applications】 ■Application to three-dimensional photolithography ■Application to semi-additive methods, etc. *For more details, please refer to the catalog or feel free to contact us.

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Introduction to Electroplating Processing Technology

Introduction to Electroplating Processing Technology

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フォトプレシジョン

フォトプレシジョン

Manufacturing and processing contract

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Photo Precision Co., Ltd. is a company that contributes to prototyping and development in various fields, including microelectronics and optical products, with photofabrication as its core technology. Next-generation industrial core products such as MEMS (Micro Electro Mechanical Systems), biochips, and microchemical chips are formed by the complex application of technologies such as nanotechnology, three-dimensional micromachining, high-density three-dimensional packaging, and three-dimensional photolithography. Photofabrication is deeply involved in all of these technologies and serves as the foundational technology for MEMS development. We strive for continuous technical improvement with the support of our customers, while also introducing advanced equipment as much as possible to meet the diverse needs of our clients.

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