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  3. Measurement and Analysis
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  5. X-ray inspection equipment
  6. [Application Example] BGA Void Analysis Technology "BGA Pro"

[Application Example] BGA Void Analysis Technology "BGA Pro"

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Application software "BGA Pro"

last updated:Sep 27, 2018

ビームセンス
ビームセンス
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Clearly display the state inside the solder and assist with soldering analysis!

We would like to introduce a product that applies "Smart X-ray." "BGA Pro" assists in soldering analysis by calculating and processing image signal changes of BGA and CSP that are not visible in regular X-ray transmission images, quantifying their size and position, and clearly displaying the internal condition of the solder. 【Applicable Uses】 ■ By quantifying the void state of BGA and CSP, it can evaluate the soldering condition. ■ Understanding the void state can be utilized as information for setting conditions such as reflow. *For more details, please refer to the PDF document or feel free to contact us.

    Other measurement, recording and measuring instrumentsX-ray inspection equipmentOther image-related equipment
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[Application Example] BGA Void Analysis Technology "BGA Pro"

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  • Related Link - http://beamsense.co.jp/

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[Application Example] BGA Void Analysis Technology "BGA Pro"

[Application Example] BGA Void Analysis Technology "BGA Pro"

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ビームセンス

ビームセンス

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Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.

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