Clearly display the state inside the solder and assist with soldering analysis!
We would like to introduce a product that applies "Smart X-ray." "BGA Pro" assists in soldering analysis by calculating and processing image signal changes of BGA and CSP that are not visible in regular X-ray transmission images, quantifying their size and position, and clearly displaying the internal condition of the solder. 【Applicable Uses】 ■ By quantifying the void state of BGA and CSP, it can evaluate the soldering condition. ■ Understanding the void state can be utilized as information for setting conditions such as reflow. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![[Application Example] BGA Void Analysis Technology "BGA Pro"](https://image.mono.ipros.com/public/catalog/image_generated/01/700/433339/433339_IPROS7707539540509288442_1.jpg?w=120&h=170)
Company information
Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.