Utilizing the flexibility of the substrate, it can be implemented without a heat sink even on curved surfaces!
The "Silicone-based substrate" is a flexible printed circuit board that uses high thermal conductivity silicone sheets. Silicone resin is highly flexible and can be expected to prevent solder cracks during heat cycles. Additionally, by utilizing the flexibility of the substrate, it can be implemented without a heat sink on curved surfaces. 【Features】 ■ Flexible printed circuit board ■ Uses high thermal conductivity silicone sheets ■ Prevents solder cracks during heat cycles ■ Can be implemented without a heat sink on curved surfaces *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Available Surface Treatments】 ■ Heat-resistant preflux ■ Electroless tin plating ■ Electroless nickel plating *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Substrate for thermoelectric power generation modules ■ Circuit board for power modules ■ Substrate for power LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.
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1) ODM Business (LED-related products, IoT-related systems / communication, imaging, medical devices, evaluation boards, etc.) ■ Contract services from product development to manufacturing 2) Special Substrate Business (Heat dissipation substrates, high current substrates, high-frequency substrates, power module substrates, etc.) ■ Sales through domestic and overseas manufacturing routes 3) Solution Business ■ Design / Manufacturing Solutions (Design, substrates, component procurement, prototype and mass production of assembly) ■ Business Solutions (Sales outsourcing, agency, infrastructure support, business succession support, etc.) ■ International Human Resource Introduction Solutions - Technical Intern Trainees (Vietnam) - Specified Skilled Worker No. 1 (Myanmar, Bangladesh, Sri Lanka) - Full-time Employees (domestic and overseas)