Achieves high heat dissipation! It can be relatively easily changed from the current substrate!
The "copper inlay substrate" is a printed circuit board that improves heat dissipation characteristics in specific areas by press-fitting copper pins directly beneath heat-generating components. By directly contacting heat-generating components with copper, which has high thermal conductivity, it achieves excellent heat dissipation and can be relatively easily modified from existing substrates. It enhances heat dissipation performance, which was insufficient with thermal vias that only have through holes. Additionally, it can suppress cost and weight increases associated with heat dissipation, and since it can directly apply the existing printed wiring board structure, it allows for relatively easy adaptation in printed circuit board design. 【Features】 ■ Partially improves heat dissipation characteristics ■ Relatively easy to modify from existing substrates ■ Enhances heat dissipation performance ■ Can suppress cost and weight increases related to heat dissipation ■ Can directly apply the existing printed wiring board structure, allowing for relatively easy adaptation in printed circuit board design *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Base Material: FR-4.0, CEM-3 ・Halogen-free materials and high Tg materials can also be accommodated ■Copper Foil: 18μm, 35μm ・Can accommodate 70μm or more ■Board Thickness: 1.0mm, 1.6mm ・Please consult separately ■Copper Pin Spacing: More than board thickness ・Please specify the copper pin locations on the drawing ■Copper Pin Shape: Round ・Please consult separately for irregular shapes. ■Inlay Method: Press Fit ・Press fitting for NTH through holes and copper-plated through holes ■Surface Treatment: Heat-resistant preflux ・Lead-free solder leveling ・Electroless Au flash plating can be accommodated *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Substrate for thermoelectric power generation modules ■ Circuit board for power modules ■ Substrate for power LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
1) ODM Business (LED-related products, IoT-related systems / communication, imaging, medical devices, evaluation boards, etc.) ■ Contract services from product development to manufacturing 2) Special Substrate Business (Heat dissipation substrates, high current substrates, high-frequency substrates, power module substrates, etc.) ■ Sales through domestic and overseas manufacturing routes 3) Solution Business ■ Design / Manufacturing Solutions (Design, substrates, component procurement, prototype and mass production of assembly) ■ Business Solutions (Sales outsourcing, agency, infrastructure support, business succession support, etc.) ■ International Human Resource Introduction Solutions - Technical Intern Trainees (Vietnam) - Specified Skilled Worker No. 1 (Myanmar, Bangladesh, Sri Lanka) - Full-time Employees (domestic and overseas)