Printed circuit board "copper inlay board"

Achieves high heat dissipation! It can be relatively easily changed from the current substrate!

The "copper inlay substrate" is a printed circuit board that improves heat dissipation characteristics in specific areas by press-fitting copper pins directly beneath heat-generating components. By directly contacting heat-generating components with copper, which has high thermal conductivity, it achieves excellent heat dissipation and can be relatively easily modified from existing substrates. It enhances heat dissipation performance, which was insufficient with thermal vias that only have through holes. Additionally, it can suppress cost and weight increases associated with heat dissipation, and since it can directly apply the existing printed wiring board structure, it allows for relatively easy adaptation in printed circuit board design. 【Features】 ■ Partially improves heat dissipation characteristics ■ Relatively easy to modify from existing substrates ■ Enhances heat dissipation performance ■ Can suppress cost and weight increases related to heat dissipation ■ Can directly apply the existing printed wiring board structure, allowing for relatively easy adaptation in printed circuit board design *For more details, please refer to the PDF document or feel free to contact us.

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