Achieves high thermal conductivity and bottle-less lightweight construction through adhesive methods.
It is a high thermal conductivity material with a high filling of heat dissipation fillers using our company's unique polymer blending technology, and it has the following characteristics.
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basic information
**Features** 1. It demonstrates high thermal conductivity and insulation, flexibly accommodating various heat dissipation designs. 2. Being in paste form, it excels in adhesion between heat dissipating and heat generating components, and the reduction of thermal resistance through thin film application can be expected to provide high heat dissipation effects. 3. With excellent adhesion, heat resistance, and durability, it supports adhesive methods, contributing to thin film application, weight reduction, and process simplification without the need for bolts.
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Applications/Examples of results
In-vehicle ECU/CPU/optical pickup/power module/LED
Company information
Since its founding, the Sunstar Group has upheld the corporate philosophy of "always serving to enhance people's health and improve the quality of life," providing products and services that are needed in society. Our roots trace back to the manufacturing and sales of bicycle parts, which began in 1932.
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