サンスター技研 Company Profile

Business Activities

The Chemical Division operates in various production material fields while considering coexistence with the environment. We have developed unique foam gasket systems that leverage our core technology, as well as sealing materials and underfill materials for electronic devices, including mobile phones, enhancing customer satisfaction with cutting-edge technology. ■ Products Offered 【Foam Gaskets】 This is a groundbreaking foam gasket system capable of various molding processes such as string application using sealing robots, compression molding, injection molding, and foam filling. Main applications: Waterproofing, dustproofing, and cushioning gaskets for automotive and electrical components. 【Underfill】 This resin is used to reduce heat and mechanical stress applied to solder joints of electronic components. Based on epoxy resin toughening technology and low-temperature rapid curing technology, we can design and propose underfills tailored to user needs. 【Thermal Conductive Adhesives】 The adhesive (in paste form) excels in adhesion to substrate surfaces and can reduce thermal resistance. Additionally, by thinning the film, we can improve thermal conductivity and provide efficient heat dissipation solutions.

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