Surface roughness precision Ra 0.1~0.3 nm! Achieving smooth mirror surfaces of polycrystalline materials with our proprietary CMP slurry and polishing pads!
This catalog is a comprehensive catalog of D-process, which conducts CMP and wafer direct bonding prototyping and mass production, along with the transfer of associated processes. It provides detailed information on contract processing for CMP, wafer bonding, seed layer formation, and plating, among others. [Contents (excerpt)] ■ Contract processing for CMP ■ Contract processing for wafer bonding ■ Contract processing for seed layer formation and plating ■ Other contract processing for processes ■ Back grinding (thinning) / Lapping / Diamond polishing ■ Edge treatment / Dicing *For more details, please refer to the PDF document or feel free to contact us.
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【Other Listings】 ■ Photolithography ■ Wet Etching ■ Ultra-Precision Cleaning ■ Examples of Applications and Materials ■ Total Foundry ■ Company Overview *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While various structures such as MEMS devices and TSVs are being examined, we are developing appropriate CMP slurries in-house to accommodate the CMP processes of next-generation devices and are providing CMP contract processing tailored to our customers' needs. We not only handle mass production processing from a few prototypes to tens of thousands of units but also conduct technical transfers (CMP process transfers).