D-process Company Overview

D-process can offer a wide range of services from prototyping/ development to mass production.

D-process provides integrated Foundry service services focused on CMP Foundry service and bonding Foundry service for prototyping/development and mass production of various electronic devices. ●Processing offered by D-process ・Procurement of various wafers ・Insulation layer formation by various film formation methods (SiO2, CVD, TEOS, etc.) ・Mask production and patterning (wet etching/dry etching, etc.) ・Barrier metal formation (Ta, TaN, Ti, TiN, Cr, etc.) ・Seed layer formation by sputtering, deposition, and electroless plating to plating processing such as for Cu, Au, Ni, etc. ・Planarization by CMP contract processing ・Wafer bonding contract processing after CMP wafer pre-processing (room temperature bonding, plasma-activated bonding, diffusion bonding, eutectic bonding, resin bonding, temporary bonding/debonding) ・Edge processing such as terrace processing and trimming processing ・Backside grinding - Thinning by CMP ・Conversion into small pieces by dicing ・Quality assurance by various measuring instruments such as AFM, profilometer, film thickness gauge, thickness gauge, SEM, ultrasonic microscope (C-SAM), IR, etc.