CMP cleaning machine
Post-CMP cleaning of MEMS is a very delicate process. There are many MEMS devices with three-dimensional structures, making it extremely challenging to clean without damaging the structures themselves. By fully utilizing the cleaning technology for MEMS devices that we have developed over many years, it is possible to return MEMS devices to the existing line after CMP processing. ● For other functions and details, please download the catalog.
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basic information
Post-CMP cleaning of MEMS is a very delicate process. There are many MEMS devices with three-dimensional structures, and it is extremely challenging to clean them without damaging the structures themselves. By fully utilizing the cleaning technology for MEMS devices that we have developed over many years, it is possible to return MEMS devices to the existing line after CMP processing. ● For other functions and details, please download the catalog.
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Applications/Examples of results
【Usage】 ○ Double-sided scrub cleaning ○ SC1 cleaning ○ SC2 cleaning ○ Various chemical cleaning ○ DHF cleaning ○ Megasonic cleaning
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Company information
D-process provides integrated Foundry service services focused on CMP Foundry service and bonding Foundry service for prototyping/development and mass production of various electronic devices. ●Processing offered by D-process ・Procurement of various wafers ・Insulation layer formation by various film formation methods (SiO2, CVD, TEOS, etc.) ・Mask production and patterning (wet etching/dry etching, etc.) ・Barrier metal formation (Ta, TaN, Ti, TiN, Cr, etc.) ・Seed layer formation by sputtering, deposition, and electroless plating to plating processing such as for Cu, Au, Ni, etc. ・Planarization by CMP contract processing ・Wafer bonding contract processing after CMP wafer pre-processing (room temperature bonding, plasma-activated bonding, diffusion bonding, eutectic bonding, resin bonding, temporary bonding/debonding) ・Edge processing such as terrace processing and trimming processing ・Backside grinding - Thinning by CMP ・Conversion into small pieces by dicing ・Quality assurance by various measuring instruments such as AFM, profilometer, film thickness gauge, thickness gauge, SEM, ultrasonic microscope (C-SAM), IR, etc.
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