From spot prototyping to mass production of 24,000 units per month, we offer a wide range of support! We can accommodate all kinds of materials!
We can accommodate a wide range of production volumes, from small-scale spot prototypes of about 1 to 10 pieces to mass production of approximately 24,000 pieces per month. This includes ultra-fine CMP for MEMS devices, track media, and patterned media. ■ Features of Our CMP Contract Processing We secure a significant process margin by developing slurries in-house for all kinds of materials that are not currently addressed in the market. We achieve high precision in response to requirements such as polishing rate, processing selection ratio, and surface roughness. ■ Example of Material Achievements Metal materials: Au, Ag, Cu, Al, W, Ta, TaN, Ti, TiN, Ni, Ni-p, Ni-Fe, Cr, ZnO, etc. Insulating materials: SiO2, TEOS, various polymers, etc. Substrate materials: Si, SiC, GaN, Al2O3, Al2O3 composites, polymers, etc.
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We can accommodate a wide range of production, from small-scale spot prototypes of about 1 to 10 pieces to mass production of approximately 24,000 pieces per month. This includes ultra-fine CMP for MEMS devices, track media, and patterned media. ■ Features of our CMP contract processing We ensure a significant process margin by developing slurries in-house for all kinds of materials that are not addressed in the market. We achieve high precision in response to requirements such as polishing rate, processing selection ratio, and surface roughness. ■ Example of material achievements Metal materials: Au, Ag, Cu, Al, W, Ta, TaN, Ti, TiN, Ni, Ni-p, Ni-Fe, Cr, ZnO, etc. Insulating materials: SiO2, TEOS, various polymers, etc. Substrate materials: Si, SiC, GaN, Al2O3, Al2O3 composites, polymers, etc.
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Applications/Examples of results
■Application Achievements MEMS devices, TSV, TGV, pre-surface activated bonding CMP, pre-anodic bonding CMP, next-generation LSI Power devices (Si, SiC, GaN), patterned media (magnetic materials, etc.), track media, various ceramics, composite materials of various ceramics and metals, etc...
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D-process provides integrated Foundry service services focused on CMP Foundry service and bonding Foundry service for prototyping/development and mass production of various electronic devices. ●Processing offered by D-process ・Procurement of various wafers ・Insulation layer formation by various film formation methods (SiO2, CVD, TEOS, etc.) ・Mask production and patterning (wet etching/dry etching, etc.) ・Barrier metal formation (Ta, TaN, Ti, TiN, Cr, etc.) ・Seed layer formation by sputtering, deposition, and electroless plating to plating processing such as for Cu, Au, Ni, etc. ・Planarization by CMP contract processing ・Wafer bonding contract processing after CMP wafer pre-processing (room temperature bonding, plasma-activated bonding, diffusion bonding, eutectic bonding, resin bonding, temporary bonding/debonding) ・Edge processing such as terrace processing and trimming processing ・Backside grinding - Thinning by CMP ・Conversion into small pieces by dicing ・Quality assurance by various measuring instruments such as AFM, profilometer, film thickness gauge, thickness gauge, SEM, ultrasonic microscope (C-SAM), IR, etc.
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