Successfully reduced processing time! It is now possible to minimize dishing to the extreme.
We offer "TSV CMP Contract Processing." By applying a CMP process using a slurry that ensures nearly 10 times the processing speed compared to the Cu slurry typically used for semiconductor Cu CMP, we can complete processing in a short time. With our CMP contract processing, we have achieved ultra-high precision and low cost through the establishment of ultra-fast Cu CMP. 【Features】 ■ Reduced processing time ■ Contributes to improved processing accuracy ■ Ultra-fast Cu CMP process ■ Minimization of dishing ■ Achieves ultra-high precision and low cost *For more details, please refer to the PDF document or feel free to contact us.
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【Example of a Process】 <Case of applying the damascene process to form Cu plugs in Si through holes> 1. Decreased throughput due to thick films 2. Deterioration of in-plane uniformity due to long processing times 3. Substrate warping on the order of hundreds of micrometers caused by thick films 4. Difficult structures using various wiring, barrier, and insulating materials 5. Decreased substrate strength due to the through-hole structure *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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While various structures such as MEMS devices and TSVs are being examined, we are developing appropriate CMP slurries in-house to accommodate the CMP processes of next-generation devices and are providing CMP contract processing tailored to our customers' needs. We not only handle mass production processing from a few prototypes to tens of thousands of units but also conduct technical transfers (CMP process transfers).