Leadless package without the need for mold tooling! Product launch possible with low development costs.
The "COBP (Chip On Board Package)" is a flexible leadless package suitable for product groups with small quantities and a wide variety, trial runs with reduced initial costs, and selection of package sizes tailored to customer requirements. After chip mounting, wire bonding is performed, and resin selection and sealing are done according to the application. Our company is capable of integrated production from wafer dicing to testing and taping. We provide support from line design to final test setup and reliability testing evaluation. 【Features】 ■ Product launch is possible with low development costs due to mold-less design. ■ High design flexibility in package layout (optimized shape corresponding to pin count, pitch, multi-chip, etc.). *For more details, please refer to the PDF materials or feel free to contact us.
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【Overview】 ■Examples of mass production products - Surface mount photoreflectors (position detection, equipped with LED, with lens) - Photodiodes - RFID (IC tags), etc. ■Production capacity: Please inquire ■Compatible wafer sizes: 4 to 8 inches ■Wire specifications: Gold wire 20 to 30μm ■Mold resin: Epoxy-based resin ■Package size: Can be freely cut out on the active area (product area) (110×30mm) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Hamada Technos Co., Ltd. is engaged in the development and manufacturing of electronic devices and IC tags. We also conduct semiconductor manufacturing, module component design and manufacturing, as well as IC tag manufacturing, processing, and software development. Please feel free to contact us if you have any inquiries.