5G LCP FCCL "SAR25C12"
Liquid Crystal Polymer Film (LCP) "SARAS"
Next-generation high-speed communication 5G, automotive millimeter-wave radar, FPC for LiDAR, FCCL applications.
**Product** 5G LCP FCCL "SAR25C12" **What is SAR25C12** As the frequency increases, the amount of information that can be transmitted per unit time can be accelerated and made larger. For next-generation high-speed communication, it is effective that the dielectric loss decreases as the dielectric constant and dielectric loss tangent of the FPC material decrease. In addition to these excellent electrical characteristics of low dielectric constant and low dielectric loss tangent, LCP, which also has low moisture absorption, heat resistance, and a coefficient of thermal expansion comparable to metals, as well as moldability, is an essential resin material for next-generation high-speed communication. The liquid crystal polymer film flexible copper-clad laminate "SAR25C12" is a groundbreaking product that leverages its excellent compatibility with copper foil for insulation film applications in flexible printed circuits (FPC). **Features of LCP** - Excellent electrical properties at high frequencies - Excellent heat resistance - Insulating substrate with thermal conductivity - Low moisture absorption (low dielectric) - Thermoformability at 250°C - Gas barrier properties - Anisotropic *For more details, please refer to the PDF document or feel free to contact us.*
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basic information
**Basic Physical Properties of LCP** <Numbers (Conditions)> ■Electrical Properties - Dielectric Constant: 3.09 (1GHz) - Volume Resistivity: 90×10^17Ω·cm (23℃) ■Water Absorption Properties - <0.1ppm/℃ (85℃/85%RH for 168 hours) ■Mechanical Properties - 60MPa (25℃) - 3,000MPa (25℃) - 7% (25℃) ■Thermal Properties - Solder Heat Resistance: PASS (270℃ for 30 seconds, 300℃ for 3 seconds) - 316℃ (DSC Method) - 0.38W/(m·k) *For more details, please refer to the PDF document or feel free to contact us.*
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【Applications】 ■ Electronics and Communication - Smartphones: Microphone and speaker diaphragms - Next-generation high-speed communication 5G, automotive millimeter-wave radar, LiDAR circuit boards: FPC substrate materials ■ Automotive and Transportation - Electrical components: Engine spacers, vibration-damping heat dissipation plates around LEDs - Mechanical components: Seals and gaskets *For more details, please refer to the PDF document or feel free to contact us.
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Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials, including construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
