SAMBA head printing control board USB 3.0 communication specification version
SAMBA head printing control board
Printing control board for FujiFilm Dimatix's SAMBA head G3L. Ultra-fast USB 3.0 communication specification version.
Printing control board for FujiFilm-Dimatix SAMBA Head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Print speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second print data transfer when connecting one board to USB. * Print memory: 1GB equipped. Next print data can be transferred during printing. - Maximum ejection cycle: 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Configurable as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Printing control software that makes system construction easy is also provided. * User application DLLs can be supplied. - Ink circulation pump available for SAMBA head.
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basic information
Printing control board for FujiFilm-Dimatix SAMBA Head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Print speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second print data transfer when connecting one board to USB. * Print memory: 1GB equipped. Next print data can be transferred during printing. - Maximum ejection cycle of 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Can be configured as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Printing control software that makes system construction easy is also provided. * User application DLLs can be supplied. - Ink circulation pump for SAMBA head is available.
Price information
Please consult with us.
Price range
P4
Delivery Time
Applications/Examples of results
Inkjet printing equipment
Detailed information
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Printing control board for Fujifilm-Dimatix SAMBA head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Printing speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second printing data transfer when one board is connected to USB. * Printing memory: 1GB included. Next printing data can be transferred during printing. - Maximum ejection cycle of 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Configurable as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Easy-to-build printing control software is also supplied. * User application DLLs can be provided. - Ink circulation pump available for SAMBA head.
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Company information
Y-Drive Co., Ltd. is a company that develops and researches printed electronics technology. In addition to the production of electronic devices using inkjet methods, micro-nano molding methods, and printing methods, we also undertake the fabrication of fine 2D and 3D printed wiring/structures (fabrication of structures at scales below a few micrometers) and the development of various electronic circuit boards. We also accept contracts for various image processing software (camera systems and 3D sensor systems), FPGA design, electronic control software development, and embedded electronic device development.
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