Presenting technical data: Information on the specifications and relationship between masks and solder.
"Ky Technical Report" is a technical document that includes technical information and special responses related to the manufacturing operations conducted at K-Y Electronics. Recently, the trend towards smaller components has led to the adoption of highly challenging parts in the industrial equipment sector. This document explains the relationship between metal masks and cream solder. It discusses how to reduce the printing difficulty for components sized 0603 and below (including 0603). [Contents] ■ Specifications of metal masks ■ Cream solder ■ Relationship between masks and solder ■ Summary *For more details, please refer to the PDF document or feel free to contact us.
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Our company is engaged in assembly operations in Osaka. Although we are a small town factory, we can produce everything from SMT assembly to unit assembly. In particular, we are capable of high-density and narrow-pitch CSP assembly. We can also inspect BGA and other components using X-ray inspection equipment. Most of our orders are for small lot items (around 50 to 1,000 units), so we do not seek large lot orders (such as tens of thousands of units). Because we focus on small quantities, we have abandoned the idea of reducing defects at each process and repairing finished products later. Instead, we prioritize high-quality production by carefully selecting solder based on the opening and difficulty of each component during mask creation. Please take a look at our website for an overview of our company and detailed equipment information.
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