[Heat Resistant 260℃] Reusable adhesive jig! Improves efficiency in the transport process of thin substrates and small components, contributing to SDGs! Samples available now!
The reusable adhesive jig "MagiCarrier" is a transport jig for circuit boards and small components. It secures the workpiece using adhesive resin. It has a wide range of applications, including the reflow assembly process for circuit boards and the transport of small components. 【Features】 ■ Heat resistance: Adhesive strength is maintained even when used in the high-temperature environment of a reflow oven (approximately 260°C). ■ Cleaning: Adhesive strength can be restored through washing with water or ethanol. ■ Customization: We can propose jig specifications tailored to customer requirements. ■ High durability: It can be reused for a longer time not only in the aforementioned high-temperature environment but also at room temperature. ■ Easy to peel: The adhesive strength remains unchanged and is easy to peel even after heating and cooling, reducing damage to the workpiece during removal. ■ Adjustable adhesive strength: Peel strength can be selected according to the application and workpiece. *For more details, please refer to the catalog or contact us.
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basic information
【Specifications】 ◆Base…Heat-resistant black glass epoxy, aluminum, SUS, heat-resistant glass, etc. ◆Adhesive type (weak, strong, super strong)…Adhesive strength can be adjusted according to your preference ◆Maximum product size…600mm × 500mm ◆We propose various adhesive resin designs and shapes using our unique special method *Please check the catalog for details.
Price information
Since this is a custom product, we will provide a quote based on the specifications. Please feel free to contact us.
Delivery Time
P4
※Due to the custom nature of the product, delivery times may vary depending on specifications. Please feel free to contact us.
Applications/Examples of results
≪Example≫ ■ Implementation and manufacturing process of flexible (FPC) substrates ■ Implementation and manufacturing process of thin substrates ■ Manufacturing process of flat displays such as organic EL and touch panels ■ Thin film transport in semiconductor manufacturing processes ■ Flip chip and BGA substrate implementation process
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Company information
Kyosha Co., Ltd. provides one-stop solutions from PCB design to assembly. Our approach starting from board design allows for maximization of assembly efficiency and optimization of assembly conditions. We cater to both prototype development and mass production, so please feel free to consult us. Additionally, we support our customers' assembly needs with various assembly-related tools, including the highly acclaimed high-temperature adhesive carrier "MagiCarry" and flow soldering transport carriers.
