A printed circuit board using a highly heat-dissipating aluminum base! We also accommodate small lot production.
"Aluminum substrate" is a printed circuit board that uses a high thermal conductivity aluminum base. The material accommodates board thicknesses from 0.6mm to 3.0mm, and it can support copper foil thicknesses from 35um to 105um. The maximum sizes are 600mm x 400mm and 1500mm x 250mm. Small lot production can reduce initial mold costs through router processing. Mass production can lower substrate costs with mold support. 【Features】 - Uses a high thermal conductivity aluminum base - Supports various types of data - Capable of panelization for mass production from individual piece data *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Material (Thickness): 0.6mm to 3.0mm ■Copper foil thickness: 35um to 105um ■Maximum size: 600mm x 400mm / 1500mm x 250mm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our partner factory in China specializes in prototype printed circuit boards, characterized by "short delivery times," "high quality," and "low prices." We have two factories in the Pearl River Delta region, with a monthly production capacity of 7,000 square meters and over 4,000 varieties. We have numerous transaction records, including with multinational companies from Japan, the United States, and Europe.