Back grinding protective tape for semiconductor wafers
Back grind tape is used to protect the circuit surface from scratches, chipping, cracking, and contamination caused by external foreign substances during the back grinding process of the wafer. - Excellent adhesion to uneven wafers such as circuit surfaces - Excellent peelability
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Back Grinding Tape for Semiconductor Wafers 【Features】 Back grinding tape is used to protect the circuit side of the wafer from scratches, chipping, cracking, and contamination caused by external foreign substances during the back grinding process. - Excellent adhesion to uneven wafers such as circuit surfaces - Superior easy peel-off properties 【Applications】 Grinding and cleaning processes for semiconductor wafers
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Grinding and cleaning process of semiconductor wafers
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Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials, including construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.