Achieved 10,000 units per month! Comprehensive repair including disassembly, parts replacement, assembly, inspection, quality control, and parts management.
Our company also offers contract manufacturing (including quality control) that leverages our experience in mobile phone repairs. We have a track record of 10,000 units per month, providing comprehensive repair services that include disassembly, parts replacement, assembly, inspection, quality control, and parts management. Please feel free to inquire about small lot manufacturing as well. 【Features】 ■ Track record of 10,000 units per month ■ Comprehensive repair services ■ Assembly manufacturing utilizing our mobile phone repair experience ■ Consultation available for small lot manufacturing *For more details, please refer to the PDF document or feel free to contact us.
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【Workflow】 ■Diagnosis ・Confirm the reported issues and check for any other malfunctions ■Disassembly ・Disassemble using an electric screwdriver and remove connectors that connect the circuit board and components ■Internal Inspection ・Check for any damage to the internal circuit board or components ■Circuit Board Repair ・Identify the faulty areas based on the circuit diagram and replace components such as ICs and connectors ■Assembly ・Replace the faulty circuit board and components, then assemble ■Various Inspections ・Conduct inspections of various operations, performance, and appearance ■Shipping *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.