Soldering defect: residue cracking

We will introduce knowledge and techniques related to soldering defects, including issues and countermeasures for residue cracking.

Residue cracking is a phenomenon that occurs when physical forces such as thermal contraction and bending are applied to flux residue, leading to cracking and delamination. When cracks occur in the residue, phenomena such as moisture absorption at the crack site can arise, resulting in decreased electrical reliability. Additionally, if delaminated flux enters switch contacts, it can cause operational failures. Countermeasures for residue cracking include cleaning the substrate and applying coatings; however, both of these options incur additional costs. Therefore, it is recommended to use solder and solder paste that do not crack under residue. Our company offers solder and solder paste that address residue cracking issues. Please contact us through our website for samples. 【Overview】 ■Issues with residue cracking - Phenomena such as moisture absorption at the crack site lead to decreased electrical reliability. - Delaminated flux entering switch contacts can cause operational failures. - Countermeasures for residue cracking include cleaning the substrate and applying coatings after soldering, but both incur costs. - Using solder and solder paste that do not crack under residue can resolve issues caused by residue cracking.

Solder