Introducing fine powder paste.
The particle size of solder powder used in solder paste must be selected appropriately according to the mounted components. As miniaturization of components used in small mounted products progresses, it is necessary to narrow the inner diameter of the metal mask openings and dispensing nozzles to stably apply a small amount of solder to the mounting substrate, which requires the use of fine powders. Fine powders not only have a smaller diameter but also have an increased surface area per unit weight. As a result, issues arise such as: - Decreased wettability - Increased solder balls - Decreased stability during use (continuous application) These challenges necessitate the development of specialized fluxes to address them. We offer a syringe-type solder paste using Type 5 (10-25) powder, which resolves the above issues, and it has already been adopted by our users. *For more details, please feel free to contact us.
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.