Thickness from 0.1mm to 3.0mm, can be cut up to 8 inches in size!
Our company uses diamond blades for precision cutting of substrates and electronic components such as ceramics, glass, glass epoxy (FR-4), and Teflon. We also offer suggestions for reducing burrs and chipping in copper through-holes using dicing processing. By using press and router processing, we can reduce metal burrs and chipping, as well as minimize damage within through-holes. 【Features】 ■ Equipped with a Class 10000 clean room ■ Cutting equipment including dicing machines (twin spindle) ■ Various inspection equipment that guarantees quality through reliable inspections ■ A comprehensive facility system to meet customer requests *For more details, please download the PDF or feel free to contact us.
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【Equipment】 ■ Dicing Machine - Disco / D3650 (Twin Spindle) - Tokyo Seimitsu / A-WD-10A, etc. ■ Microscope - Nikon, magnification 6x to 50x, etc. ■ Mantis - Vision Company magnifier, 2x to 10x ■ UV Curing Device ■ Vapor Cleaning Machine - A.S.K. Corporation, etc. *For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the cutting of electronic components and semiconductor parts using die-sinking machines, as well as substrate inspection and the assembly of DC motors. The demand for component manufacturing is becoming increasingly sophisticated, but the products we deliver provide reliable solutions to various industry requirements in terms of applicability, robustness, and more. Focusing on stable products, we will continue to strive to create products that will please everyone, including accommodating small lots and various models, so please look forward to it. Since March 2022, we have started selling our own product, a 12-inch compatible tabletop LED UV irradiator, the Fks300W LED.