Semiconductor device aluminum heat sink
This is a heat sink for a semiconductor device made from 10.0mm aluminum material through machining. Machining is a processing method that uses machine tools to manufacture parts, allowing for the mass production of identical shapes with high precision.
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basic information
Material: A5052P / t=10.0 Dimensions: 10 × 109.4 × 65 Process: Machining Application: Semiconductor device heat dissipation plate
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Applications/Examples of results
It is used as an aluminum heat sink for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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