Semiconductor device mesh cover
This is a precision sheet metal processing product made from A5052P (aluminum material) with a thickness of 1.0mm. The main processes are punching, drilling, and anodizing in that order. This product is used as a mesh cover for semiconductor equipment. The production time, including anodizing, is approximately 2 to 3 days for a lot of 500 units.
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basic information
Material: A5052P / t=1.0 Dimensions: 80 × 110 Process: Precision sheet metal processing, white anodizing Application: Semiconductor equipment mesh cover
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Applications/Examples of results
This product is used as a mesh cover for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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