Semiconductor device top plate
This is a precision sheet metal processing product made from SPCC (cold-rolled steel sheet) with a thickness of 1.2mm. The main processing involves punching, followed by pre-processing, trivalent chromate plating, and silk screening in that order. This product is used as a top plate for semiconductor equipment. The production time, including plating treatment and silk screening, is approximately 3 to 4 days for a batch of 100 units.
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basic information
Material: SPCC / t=1.2 Dimensions: 196 × 340 Process: Precision sheet metal processing, trivalent chromate plating, silk printing Application: Semiconductor equipment top plate
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Applications/Examples of results
This product is used as a top cover for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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