Semiconductor device stage
This is a precision sheet metal processing product made from SPCC (cold-rolled steel sheet) with a thickness of 1.2mm. The main processing involves punching, followed by pre-processing, bending, and then trivalent chromate plating. This product is used as a bracket for semiconductor equipment. The production time, including painting, is approximately 2 to 3 days for a lot of 100 units.
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basic information
Material: SPCC / t=1.2 Dimensions: 20 × 340 Process: Precision sheet metal processing Treatment: Trivalent zinc plating Application: Semiconductor equipment bracket Delivery time: Approximately 2 to 3 days
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Applications/Examples of results
This product is used as a stay for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
