Semiconductor device case
This is a precision sheet metal processing product made from SPCC (cold-rolled steel plate) with a thickness of 1.2mm. The main process starts with punching, followed by pre-processing and bending. After shaping is complete, trivalent chromate plating is performed, followed by final inspection. This product is used as a case for semiconductor equipment. The production time, including painting, is approximately 3 days for a lot of 100 units.
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basic information
Material: SPCC / t=1.2 Dimensions: 60 × 175 × 100 Process: Precision sheet metal processing, gold plating (trivalent unichrome) Application: Semiconductor equipment case
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Applications/Examples of results
This product is used as a case for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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