Semiconductor device chassis
This is a precision sheet metal processing product made from 1.2mm SPCC (cold-rolled steel sheet). In semiconductor-related work, particularly high processing accuracy and tolerance dimensions are required in sheet metal processing. The main process starts with punching, followed by pre-processing, bending, painting, and final inspection. This product is used as the chassis part of semiconductor equipment. The production time is estimated to be a few days to just under a week, including painting, for a lot size of 50 to 100.
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basic information
Material: SPCC / t=1.2 Dimensions: 110 × 190 × 100 Process: Precision sheet metal processing Application: Semiconductor device parts Lot: 1 piece to mass production support Delivery time: Within a few days to 1 week is the guideline
Price range
Delivery Time
Applications/Examples of results
It is used as a chassis for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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