A bottom inspection machine optimized for THT processes such as wave and selective soldering.
The "Xceed BSI" is a 3D AOI device designed to inspect the underside of a printed circuit board (PCB) without flipping it over, with the sensor head installed to face the bottom side. It can inspect PCBs that are wave or selective soldered. Since there is no need to flip the PCB, it eliminates unnecessary processes and minimizes the footprint of the device. 【Features】 ■ 3D AOI for underside PCB inspection ■ Space-saving due to no need for a flipping device ■ Complete compatibility with mirror solder joints using laser beams ■ Capable of inspecting SMDs, foreign objects, and dirt *For more details, please download the PDF or contact us.
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【Main Inspections】 ■Soldering by wave or selective soldering ■Presence or absence of pins, height, misalignment, etc. *For more details, please download the PDF or contact us.
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Our company was established in 1998 and has released innovative devices, with over 3,000 units delivered worldwide since 2005. With industry-leading cycle times and global support, we will maximize your company's profitability.