PI (Polyimide) reinforcement plate bonding processing
Consistent support from polyimide cutting to vacuum temporary bonding and complete curing for FPC.
●Features - Polyimide boasts extremely high heat resistance and excellent mechanical properties, electrical insulation, and chemical resistance, making it suitable for use in electronic components such as flexible printed circuits (FPC) in smartphones and camera modules. - With years of experience and know-how in reinforcing plates for FPCs in electronic components, we can provide a consistent service from die-cutting of polyimide to vacuum temporary bonding and complete curing after cure for supplied FPCs. - We can accommodate customer requests through consistent support across all phases, from material procurement and die-cutting to bonding with supplied components.
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basic information
【Material Sales】 ○ Thermosetting resin laminated boards and molded boards ○ Thermosetting resin laminated round bars and pipes ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics ○ Super engineering plastics ○ Copper-clad laminated boards ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing】 ○ Precision punching processing (various laminated boards, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ Functional film lamination processing ○ Optical film curved surface vacuum lamination processing ○ Contract development of jigs and devices ● For more details, please contact us or download the catalog.
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.
