Leveraging 30 years of experience in OEM manufacturing of security equipment, we support everything from prototyping to mass production!
Printed Circuit Board Assembly 【SMT Assembly】 We can assemble components ranging from tiny parts to large irregular parts. We can handle CSP, BGA (0.25mm pitch), QFP (0.2mm pitch), 0603 chips, and PLCC irregular parts. Nitrogen-compatible reflow is used. *0402 chips are currently a challenge! 【Lead Component Assembly】 We can assemble large components such as transformers, coils, electrolytic capacitors, cement resistors, and current sensors. 【Moisture-Proof Insulation Coating】 Coating agents (moisture-proof insulation materials) can be applied to both the front and back surfaces of the board. 【Board Aging】 Aging of printed circuit boards and assembled boards is possible. We can accommodate constant temperature chambers and temperature cycle testing machines.
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Printed Circuit Board Inspection 1. Checks during the SMT process - Check the printing condition of cream solder using the image inspection function of the printer - Prevent component set errors with the barcode system of the mounter - Check with an automatic visual inspection device after mounting 2. Inspection after printed circuit board assembly - Visual inspection: Check soldering condition using visual inspection devices and X-ray inspection devices - In-circuit test: Conduct electrical inspections using testing equipment - Function test: Conduct functional inspections of the board using testing equipment 3. Equipment assembly Assemble mounted boards, electrical components, mechanical parts, etc., into the casing (screwing, soldering) Wiring work is possible *Products applicable for robotic work are also available 4. Equipment inspection After wiring assembly into the equipment casing, full wiring inspection, insulation resistance testing, power-on testing, load testing, and functional testing are possible. 5. Environmental testing Conduct temperature storage tests, temperature cycle tests, etc.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.