Viola's technology meets a wide variety of needs! Using the X-ray inspection device "FX-300tRX" with CT functionality.
We offer contract services for X-ray inspections using the X-ray inspection device "FX-300tRX" with CT functionality. The inspection images (CT images are video files) will be written to a DVD and provided to you. Please use this service to check the mounting status of BGA components, discover defects, and verify the solder filling rate of inserted components. Additionally, we also provide authenticity assessments for semiconductors and electronic components. We will inspect the internal markings and patterns of the components. Please utilize this service for authenticity verification of packaging before use when purchasing stock items. The inspection results will be reported in a report format. 【Features】 ■ Compact small X-ray device with a geometric magnification of 1000 times ■ "X-ray stereo method" allows for cancellation of backside information ■ Flat panel can be tilted at 60° for observation, maintaining magnification even at an angle ■ Automatic tracking of the observation position for angled observations (the point does not shift even if the camera tilts) ■ Stereo CT functionality allows for division of approximately 3-5mm of the upper and lower parts of the mounted board into 100 segments, enabling display of tomographic information *For more details, please refer to the PDF document or feel free to contact us.
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basic information
For more details, please refer to the PDF document or feel free to contact us.
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P1
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Applications/Examples of results
【Usage】 ■X-ray inspection ■Determination of authenticity for semiconductors and electronic components We inspect the engravings and patterns inside the components. Please use this for authenticity verification of packaging before use when purchasing stock items. The inspection results will be reported in a report format. *For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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■Authenticity Verification of Semiconductors and Electronic Components We will inspect the engravings and patterns inside the components. Please use this for verifying the authenticity of the packaging before use when purchasing stock items. The inspection results will be reported in a report format.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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