Introduction to Surface Mount Technology (SMT) for Circuit Boards

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last updated：Mar 12, 2018

大興

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SMT is your go-to for high-quality products made with sincerity! We also offer low-cost proposals for prototype manufacturing.

We provide 'Surface Mount Technology (SMT)' that can quickly respond to customer needs from prototyping to mass production. Our assembly line specializes in precision mounting, focusing on components ranging from 0.4mm pitch QFP to 0.5mm pitch CSP, with a basic capacity of 25 million shots. Highly skilled operators who have cleared a rigorous on-the-job training program control the machines. Please feel free to contact us if you have any requests. 【Specifications of Mounted Components】 ■ Component Size: From 0603 square chips to large connectors measuring 100×90mm ■ Packaging Forms: - 8mm to 88mm width paper and embossed taping reels with diameters of Φ180 to 330mm - Trays (L335mm×W230mm×H25mm) *For more details, please download the PDF or feel free to contact us.

Related Link - http://www.taikoh-mie.co.jp/business/smt.html

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【Specifications of the substrate (excerpt)】 ■ Size: Min 50×50mm to Max 610×460mm (with conditions), t0.3 to 4.0mm ■ Mounting area: Components and recognition marks must be placed in an area 3.0mm from the top and bottom edges ■ Material: Glass epoxy (FR4, CEM3, etc.), other materials require condition review FPC is also mountable, but a transport pallet must be created ■ Surface treatment: Supports heat-resistant flux treatment, Au flash treatment, and solder leveling treatment *For more details, please download the PDF or feel free to contact us.