If it's about BGA rework, leave it to us! We will introduce the work process.
Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.
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basic information
Our company has been committed to creating a more environmentally friendly world by focusing on the global environment and engaging in activities such as circuit board modification, repair, BGA reballing, and component regeneration, even before the term SDGs became widely recognized. You can also trust us with BGA devices with over 3000 pins. We also offer rework for Enpirion. Enpirion is a power supply device that is a system-on-chip (PowerSoC) DC-DC converter with inductors densely integrated. *For more details, please refer to the PDF materials or feel free to contact us.
Price information
Estimated labor cost for parts replacement (rework) BGA: 3,500 yen to 10,000 yen Module: 3,500 yen to 8,000 yen QFN: 2,500 yen to 6,000 yen FET: 800 yen to 2,500 yen QFP/SOP: 500 yen to 5,000 yen Estimated labor cost for BGA reballing 5 or fewer: 6,000 yen per unit 6 to 9: 5,000 yen per unit
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Applications/Examples of results
【Purpose】 ■BGA Rework - I want to replace it for failure analysis. - I want to analyze it by exchanging it with a good product. - I want to implement it later because the device delivery time cannot be met. - Operational errors occur due to solder balls not being joined. - In such cases, please consider our BGA rework/reball and QFN rework services. - We provide high quality through spot and uniform heating using IR radiation heating methods. - You can also trust us with LGA and BGA with over 3000 pins. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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