Possesses lead-free compatible dynamic IR rework systems, among others.
We would like to introduce our company's "main equipment" that performs general electronic device repairs as well as BGA repair and rework. The "HR600" is equipped with a super high-efficiency hybrid heater, which is an evolution of the IR heater, and features an automatic component placement function through image processing, enabling fully automated rework operations. The modular type IR rework system "IR650A" supports safe rework operations in a lead-free environment and can handle a wide range of applications from large lead-free boards with high thermal capacity to delicate mobile phone boards and small PC boards, allowing for safe rework operations with simple operating procedures. Additionally, we possess lead-free compatible rework systems like the "IR550A," which guarantees uniform heating that was difficult with traditional hot air methods, and the X-ray observation device "FX-300tRX" with CT functionality. 【Main Equipment】 ■ HR600 Fully Automated Rework System ■ IR650A Rework System ■ IR550A Rework System ■ Hybrid Rework System ■ X-ray Observation Device FX-300tRX with CT Functionality *For more details, please refer to the PDF document or feel free to contact us.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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