Addressing the recent semiconductor shortage‼ We will regenerate EOL (end-of-life/discontinued) parts. Connectors from Samtec and Hirose Electric can also be reused.
We regenerate BGA, QFN, modules, QFP, SOP, connectors, and various surface mount components and discrete components. We also accept requests for changes in the composition of BGA solder (from eutectic solder balls to lead-free solder balls). Our company has been committed to creating a more environmentally friendly world through repair, reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
Inquire About This Product
basic information
We restore parts that cannot be purchased due to EOL (end of life/discontinued) to a reusable state by removing them from the circuit board. We have a track record of restoring over 20,000 BGA, 3,000 QFP, 1,500 SOP, and more than 500 modules.
Price range
P1
Delivery Time
Applications/Examples of results
We restore parts that cannot be purchased due to EOL (end of life/discontinued) by removing them from another circuit board for reuse. We also provide refurbishment to address oxidation issues for market inventory items. We have experience in lead removal from lead-plated (non-RoHS) components as well.
Detailed information
-
Removal of surface mount (SMD) type connector components.
-
Lead removal work for lead-plated (non-ROHS) parts.
-
Recycling of discrete components
-
Recycling of discrete components
catalog（1）
Download All Catalogs![[Case Study] EOL (End of Life) Component Renewal](https://image.mono.ipros.com/public/catalog/image/01/63e/499622/IPROS56207798082700368146.jpeg?w=120&h=170)
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
![[Data] ACF Crimping and Repair](https://image.mono.ipros.com/public/product/image/2c8/2000422283/IPROS11919272604378683044.jpg?w=280&h=280)
![[Information] Introduction to IR Method BGA Rework System](https://image.mono.ipros.com/public/product/image/542/2000422287/IPROS37309879112833221286.jpeg?w=280&h=280)
![[PCB Assembly] Support System from Prototyping to Mass Production | Astom Co., Ltd.](https://image.mono.ipros.com/public/product/image/6b0/2000609331/IPROS08154395261947629121.png?w=280&h=280)
