We will address all your needs related to circuit board modifications, pattern repairs, and any issues with circuit board assembly!
Our company offers a "Circuit Board Modification Service." For example, in the modification of BGA jumper wiring, we attach strap wires to the BGA balls and implement the BGA. After implementation, we guarantee quality through X-ray inspection. In addition, we handle all issues related to circuit board implementation, including prototype modifications, circuit board modifications, pattern cutting and jumper wiring, pattern repairs, circuit changes, manual implementation (chip sizes 0402 to 0603), and various component replacements. 【Circuit Board Modification Service】 ■ Circuit Board Modification ■ Pattern Cutting ■ Jumper Wiring ■ Pattern Repair ■ Pad Correction ■ Circuit Changes ■ Manual Implementation (compatible with chip sizes 0402 and 0603), etc. ■ Various Component Replacements Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment across the entire organization. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
Price information
Estimated labor cost for parts replacement (rework) BGA: 3,500 yen to 10,000 yen Module: 3,500 yen to 8,000 yen QFN: 2,500 yen to 6,000 yen FET: 800 yen to 2,500 yen QFP/SOP: 500 yen to 5,000 yen Estimated labor cost for BGA reballing 5 pieces or less: 6,000 yen per piece 6 pieces to less than 10 pieces: 5,000 yen per piece
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For more details, please refer to the PDF document or feel free to contact us.
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The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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