We will address all your needs related to circuit board modifications, pattern cutting, jumper wiring, and more!
Our company offers a "Circuit Board Modification Service," including the removal of BGA and module components. We can handle all your needs related to circuit board modifications, including pattern cutting, jumper wiring, pattern repairs, circuit changes, and manual assembly (chip sizes from 0402 and up). For circuit board modifications, trust Viola. 【Service Details】 ■ Removal and installation of BGA and module components ■ BGA reballing, reinstallation, and transplanting to different boards ■ Replacement of ICs and components with underfill ■ POP (2-layer) IC replacement, reballing, pre-stacking ■ QFN rework, IC socket installation, connector replacement ■ Replacement and reballing of BGA with uneven ball pitch ■ DDR replacement, dual-layer installation ■ Jumper wiring from underneath the BGA *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price information
Estimated labor cost for parts replacement (rework) BGA: 3,500 yen to 8,000 yen Module: 3,500 yen to 8,000 yen QFN: 1,500 yen to 4,000 yen FET: 800 yen to 2,000 yen QFP/SOP: 500 yen to 3,000 yen Estimated labor cost for BGA reballing Up to 5 units: 4,000 yen per unit 6 to 9 units: 3,500 yen per unit 10 to 19 units: 3,000 yen per unit
Price range
P1
Delivery Time
Applications/Examples of results
【Usage】 ■Circuit board mounting *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
![[Information] Introduction to IR Method BGA Rework System](https://image.mono.ipros.com/public/product/image/542/2000422287/IPROS37309879112833221286.jpeg?w=280&h=280)
![[Case Study] QFN Replacement Work](https://image.mono.ipros.com/public/product/image/658/2000439823/IPROS90784984489975956072.jpeg?w=280&h=280)
![[Presentation of Materials!] Viola Corporation Introduction to Rework and Reballing](https://image.mono.ipros.com/public/product/image/cce/2000445097/IPROS53605199118066401842.png?w=280&h=280)
